The POU3500 process gives dynamic temperature Charge of the process chamber cathode / electrode / anode and will be synchronized with any etch system.
Device & TCU software package calibration techniques range external test gear not employed regularly for verifying
Along with the POU3500, you could realize unprecedented leads to etch effectiveness, chamber uptime, lessened expense of possession and fab Room utilization – all while enhancing your method trustworthiness.
at first Established in 1985, our firm has developed into a recognized leader in furnishing temperature Management methods to the worldwide semiconductor marketplace.
This amazing process, supplying a small sort issue, cheap-of-Ownership and Dynamic Temperature Regulate available approach and machines engineers a different Software to optimize their temperature delicate processes.
The precision on the POU 3300 permits impartial Charge of the procedure fluid temperature on the wafer chuck in just +/- 0.one °C of established issue, along with the speedy reaction time from the process lets for optimum wafer-to-wafer repeatability throughout the etch course of action.
The precision of the POU 3500 permits unbiased Charge of the process fluid temperature to the wafer chuck within just +/- 0.one °C of set point, along with the quickly response time on the technique permits for maximum wafer-to-wafer repeatability throughout the etch course of action.
Together with the POU3300, you may accomplish unprecedented results in etch functionality, chamber uptime, minimized expense of ownership and fab Room utilization – all while bettering your system reliability.
the info pertains to the 300mm chamber temperature profile for the duration of a high facet ratio Etch process, working at extremely significant RF power problems (~three.8kW). The powerful components of this facts set are:
LAUDA-Noah is Assembly these new problems and has incorporated Electricity saving technological innovation in methods which can be pleasant on the setting and have a cheap to work.
The TEs' can change directly from heating to cooling, or visa-versa. they're able to switch on & off even though in the heating or cooling method and may increase or decrease the quantity of heating or cooling with out switching in any respect.
The POU3300 process presents dynamic temperature Charge of the process chamber cathode / electrode / anode and will be synchronized with any etch approach.
Confirmed; TEs' represent just one A part of a chiller's design. The switching & Manage solutions used by a chiller will effect the TEs' trustworthiness.
(thus, setting up a static unit beside chamber will not likely allow it to supply dynamic temperature Handle)
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